This is a first for a package design tool targeting Samsung’s MDI technology, and it enables early-stage PSI (power and signal integrity) analysis in connection with Siemens’ HYPERLYNX™ suite of tools.
The Siemens tools successfully evaluated by Samsung for the foundry’s advanced packaging technology include: For customers, this optimization helps enable seamless integration across multiple dies through construction of the complete MDI package assembly, allowing customers more choices on how to deliver new products to market on time and with greater performance and quality. Samsung has successfully evaluated Siemens’ digitally integrated High Density Advanced Packaging (HDAP) flow for the foundry’s MDI™ (multi-die-integration) packaging process.
“Siemens has been a strong partner for many years, and we continue to further grow our strong and highly-valued partnership in helping our mutual customers bring to market compelling new IC innovations.”
“Samsung Foundry is pleased to work closely with Siemens, which continues to increase its value to the Samsung Foundry ecosystem by offering more features in support of our latest processes,” said Sangyun Kim, vice president of Foundry Design Technology Team at Samsung Electronics. Plano, TX, USA - Novem- Siemens Digital Industries Software today announced it has enabled several of its leading electronic design automation (EDA) product families for the latest versions of Samsung Foundry’s advanced processes, including Siemens’ solutions targeting advanced packaging, electrostatic discharge (ESD) rules and integrated circuit (IC) design in the cloud.
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